非堆叠意味着单个芯片,堆叠意味着双芯片。
一些供应商将单个芯片封装称为SDP,将双芯片封装称为DDP,将四芯片封装称为QDP。
如果芯片具有多个芯片选择,则将其堆叠。
在查看MT41J128M16的Micron数据手册(第17页引脚分布图像)时,芯片似乎没有多个芯片选择,但是当您在使用的部件上搜索信息时,有多个部件以此编号开头也是
有一个后缀(-xxx)。
请检查您的确切信息。
W3630A系列数据手册还列出了给定BGA内插器不可用的信号(参见以下第7页:http://literature.cdn.keysight.com/litweb/pdf/5990-3179EN.pdf?id = 1648244
)。
如果您不需要访问A15或BA2,则可以使用W3631A。
以上来自于谷歌翻译
以下为原文
Non-stacked means single die, stacked means dual die. Some vendors refer to a single die package as SDP, dual die package as DDP, and quad die package as QDP. If a chip has more than one chip select, it is stacked.
When looking at the Micron data sheet for the MT41J128M16 (page 17 pinout image) the chip doesn't appear to have multiple chip selects however when searching for information on the part you're using there are multiple parts that begin with this number that also have a suffix (-xxx). Please check for the exact information on your part.
The W3630A series data sheet also lists what signals are NOT available for a given BGA interposer (see page 7 of the following: http://literature.cdn.keysight.com/litweb/pdf/5990-3179EN.pdf?id=1648244). You would use the W3631A if you don't need access to A15 or BA2.